LONDON — (BUSINESS WIRE) — March 7, 2016 — Technavio has announced the top five leading vendors in their recent global 3D IC market report. This research report also lists seven other prominent vendors that are expected to impact the market during the forecast period.
Competitive vendor landscape
The global 3D IC market has very few vendors at present, with the top players in the market dominating the market. The market has great potential for growth, especially in memory products, therefore, many new players are trying to qualify for TSVs technology in order to capture the market. Players like OSAT are forming strategical alliances with IDMs and other big foundries to develop the technology and gain the market. More collaboration between OSAT, IDMs, and OEMs is expected to bring down the cost of 3D ICs, which, in turn, will increase the competition in the market.
According to Asif Ghani, a lead analyst at Technavio for semiconductor equipment, “Some of the large foundries like Samsung are able to attain economy of scale, which gives them a cost advantage over their competitors. Leading vendors are also investing heavily in R&D for product development and in revamping their foundries with an aim to increase their manufacturing capacity of 3D ICs.”
Top five vendors for 3D IC market
Established in 1969 and headquartered in South Korea, Samsung Electronics is the leading seller in the 3D NAND flash market. The company has maintained its position over the past few years with its innovative technologies in the DRAM segment which has increased the demand for the company's next-generation mobile devices such as high-performance smartphones and tablet computers. In addition, the company has been able to maintain its legacy as the leading vendor in the global mobile DRAM market and is expected to continue to be the leader even during the forecast period. They manufacture DDR3 3D DRAM using TSVs technology.
Taiwan Semiconductor Manufacturing
TSMC is one of the leading vendors in the global 3D IC market. The company is also a leader in the global semiconductor foundry market. The company offers a wide range of integrated semiconductor foundry services that focus on increasing customer needs. Its unique advanced process technologies, superior design services, and high product quality have enabled it to gain a strong brand image in the global semiconductor foundry market. TSMC is the first company to have 40 nm and 60 nm production capacity.
Toshiba was founded in 1875 and is headquartered in Japan. The company follows the intellectual property strategy formulated by the Toshiba Group. The approach involves R&D focused on achieving product differentiation by collaborating ideas from the industrial and government sectors, and with academic support. Thus, extensive R&D leads to the development of innovative products, which in turn enhances patent enforcement and increases the value of its product portfolio. Toshiba has collaborated with SanDisk to manufacture 3D NAND flash based on TSVs technology.
STMicroelectronics is a major vendor in the global 3D IC market. The company is one of the leading suppliers of set-top boxes. The comapny has recently launched some of the best IC solutions such as STi7108, which offers a 3D HDTV experience for end users. This IC solution has an edge over other competitor solutions in terms of its low power configuration and high efficiency.
Advanced Semiconductor Engineering
ASE is another key player in the global 3D IC market. The company is also a key vendor in the global semiconductor packaging and testing market. Its primary services include all the processes involved in the production of semiconductors from wafer bumping to final test services. The company also develops high-quality products with the usage of 3D IC technology.
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