Mike Gianfagna, vice president of marketing at eSilicon, a leading independent semiconductor design and manufacturing solutions provider
Panel discussion: System Level Advantages of 3D Integration
International Wafer-Level Packaging Conference (IWLPC) 2014, DoubleTree San Jose, Oak Ballroom
November 11, 2014, 1:15-2:45pm
Panelists include Mike Gianfagna, eSilicon; Ramakanth Alapati, GLOBALFOUNDRIES; Bel Haba, Google; Simon McElrea, Invensas Corporation; E. Jan Vardaman, TechSearch International Inc.; Robert Patti, Tezzaron Semiconductor Corp. and Rozalia Beica, Yole Développement. Moderated by Francoise von Trapp, 3D InCites, Inc.
System-level integrators and manufacturers will face off in a discussion about the system-level advantages of 3D IC, whether 3D ICs can solve the issues of SoC design complexity and the cost of CMOS scaling to future nodes
eSilicon, a leading independent semiconductor design and manufacturing solutions provider, delivers custom ICs and custom IP to OEMs, independent device manufacturers (IDMs), fabless semiconductor companies (FSCs) and wafer foundries through a fast, flexible, lower-risk, automated path to volume production. eSilicon serves a wide variety of markets including communications, computer, consumer, industrial products and medical. www.esilicon.com
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Contacts: Sally Slemons eSilicon Corporation 408.635.6409 Email Contact Susan Cain Cain Communications 408.393.4794 Email Contact