"Today's action is the culmination of several years of discussion, careful planning, and execution," said Jeb Flemming. "Mark previously held the role of Strategic Advisor to 3DGS' Board and we are all very excited to work with him in his new role to further accelerate the growth of our business. We recently identified several new product opportunities using our patented technology and I am eager to get back to my roots and focus on continuing our technology innovation. Our business outlook looks very promising and I am very excited about this change."
Mark brings more than 25 years of senior management and high-volume manufacturing experience in the electronic components and packaging industry. Prior to joining 3DGS, Mark held several senior VP positions at Amkor Technology Inc. with a focus on creating and implementing successful strategies to penetrate new target markets, leading expansion into low-cost manufacturing services overseas, and creating strategic alliances to develop new product lines into billion-dollar revenue opportunities. Most recently, Mark held the position of Corporate VP, Global Head of New Business and Corporate Venture Capital at Henkel AG & CO. At Henkel. Mark managed business units in their semiconductor, automotive, and consumer electronic segments. Mark was also co-founder of ChipPAC, Inc. that was spun out of Hyundai Semiconductor after achieving $200+ million in annual revenue. Earlier in his career, Mark worked for Motorola, Inc. in their cellular component manufacturing division. Mark earned his BS degree in Ceramic Science and Engineering from The Pennsylvania State University and he is the inventor or co-inventor of four electronic packaging-related patents.
"Mark's proven track record of leadership, business development, and high-volume manufacturing experience, along with his strong technology background in materials science made him the ideal candidate for CEO," said Jeb Flemming. "Not only does Mark have an impressive resume but he also joins us highly motivated with a remarkable network of industry-related peers. We all look forward to the tremendous success that he will bring to our Company."
"I am extremely impressed with 3DGS' patented technology and disruptive product offerings," said Mark Popovich. "Before joining the team, I obtained a complete understanding of 3DGS' technology and I believe their products are capable of having a transformative impact in the RF and electronic components markets. I am extremely excited to join 3DGS as its Chief Executive Officer and I look forward to continuing to drive the Company's mission, product development, revenue growth, and overall operating performance."
ABOUT 3D GLASS SOLUTIONS
3D Glass Solutions (3DGS) is a world-class expert on the fabrication of electronic packages and devices using photo-definable glass- ceramics. We produce a wide variety of OEM glass-based System-in-Package (SiP) devices using our patented APEX® Glass technology for applications such as telecommunication devices, MEMS sensors, Internet infrastructure components, integrated photonic components, and high-frequency and high-performance RF devices. We have created foundational patent positions related to all photo-sensitive glass-ceramic materials and devices. 3DGS owns the fundamental intellectual property (IP) for all four positions (materials, design, systems, & manufacturing) related to glass-ceramic devices for the electronics packaging industry. We leverage our unique product solutions providing device manufacturing and systems integration services for a number of standard and custom products. To learn more about 3DGS, to become a Key Industrial Partner, or if you would like to receive a detailed 3DGS product listing, please visit http://www.3DGlassSolutions.com or contact:
Chief Financial Officer / Investor Relations
5201 Venice Ave. NE, Building D
Albuquerque, NM 87113 USA
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SOURCE 3D Glass Solutions, Inc.
|3D Glass Solutions, Inc.