SAN JOSE, Calif. — (BUSINESS WIRE) — December 12, 2013 — Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc. (Nasdaq: TSRA), announced today that it is partnering with Tezzaron Semiconductor Corporation, a pioneer and producer of 3D Integrated Circuit (3D-IC) semiconductor devices, in order to build a wide range of 3D-IC customer products.
"Today we can produce complete high-quality 2.5D (Silicon Interposer) and 3D silicon devices, but the final packaging flows are lacking,” stated Robert Patti, CTO of Tezzaron. “Invensas’ 3D-IC packaging expertise and existing pilot assembly line capability will enable us to ramp our unique products into full production. The Invensas combination of technology development and low volume manufacturing capabilities are unlike anything else available."
3D-IC technology involves the stacking of multiple Integrated Circuits with Through Silicon Vias (TSVs) into ultra dense, ultra high-performance, low-power products, using advanced semiconductor and semiconductor packaging processes. 3D-IC architecture is the fundamental building block of a broad range of next generation silicon solutions in Memory, Mobile SOC (System on Chip), RF (Radio Frequency), Image Sensor, MEMS, and Microprocessor products.
“We are delighted to take this next step in 3D-IC commercialization with Tezzaron,” said Simon McElrea, president of Invensas. “3D-IC is finally at its strategic inflection point. We have developed unique assembly capability in our pilot line in San Jose, and have built a corresponding 3D-IC patent portfolio of over 500 assets to date. Tezzaron put 3D-IC on the map, and we are excited to work with them now to deliver commercial 3D-IC products to key customers.”
Safe Harbor Statement
This document contains forward-looking statements, which are made pursuant to the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward-looking statements involve risks and uncertainties that could cause actual results to differ significantly from those projected, particularly with respect to Invensas partnering with Tezzaron, 3D-IC commercialization and the features, characteristics and benefits of Invensas products and technology. Material factors that may cause results to differ from the statements made include the plans or operations relating to the businesses of Tessera Technology, Inc. (the “Company”); market or industry conditions; changes in patent laws, regulation or enforcement, or other factors that might affect the Company's ability to protect or realize the value of its intellectual property; the expiration of license agreements and the cessation of related royalty income; the failure, inability or refusal of licensees to pay royalties; initiation, delays, setbacks or losses relating to the Company's intellectual property or intellectual property litigations, or invalidation or limitation of key patents; the timing and results, which are not predictable and may vary in any individual proceeding, of any ICC ruling or award, including in the Amkor arbitration; fluctuations in operating results due to the timing of new license agreements and royalties, or due to legal costs; the risk of a decline in demand for semiconductor and camera module products; failure by the industry to use technologies covered by the Company's patents; the expiration of the Company's patents; the Company's ability to successfully complete and integrate acquisitions of businesses; the risk of loss of, or decreases in production orders from, customers of acquired businesses; financial and regulatory risks associated with the international nature of the Company's businesses; failure of the Company's products to achieve technological feasibility or profitability; failure to successfully commercialize the Company's products; changes in demand for the products of the Company's customers; limited opportunities to license technologies and sell products due to high concentration in the markets for semiconductors and related products and camera modules; the impact of competing technologies on the demand for the Company's technologies and products; and the reliance on a limited number of suppliers for the components used in the manufacture of DOC products. You are cautioned not to place undue reliance on the forward-looking statements, which speak only as of the date of this release. The Company's filings with the Securities and Exchange Commission, including its Annual Report on Form 10-K for the year ended Dec. 31, 2012, and its Quarterly Report on Form 10-Q for the quarter ended Sept. 30, 2013, include more information about factors that could affect the Company's financial results. The Company assumes no obligation to update information contained in this press release. Although this release may remain available on the Company's website or elsewhere, its continued availability does not indicate that the Company is reaffirming or confirming any of the information contained herein.
Tezzaron Semiconductor Corporation is a world leader in the design and production of 3D-ICs including high-performance memory and sensor arrays. Tezzaron's unique device architecture and assembly methodology allows unrivaled performance and unprecedented low power. Tezzaron is the world's only turnkey 2.5D and 3D SOC supplier offering both design and fabrication services. Corporate headquarters are located at 1415 Bond St., Suite 111, Naperville, Ill. 60563. For more information, visit http://www.tezzaron.com.
Invensas Corporation, a wholly owned subsidiary of Tessera Technologies,
is a global leader in semiconductor interconnect solutions and
intellectual property. Invensas innovates in areas such as mobile
computing and communications, memory and data storage, and 3D Integrated
Circuit (3D-IC) technologies. Headquartered in San Jose, California,
Invensas licenses these solutions to Original Equipment Makers, Original
Design Manufacturers, and Integrated Device Manufacturers and delivers
the products to market through collaborative engineering partnerships
and strategic business alliances. Learn more at
PR at +1 408 324 5105 .