What: Enabling a 2.5D/3D Ecosystem
GSA Silicon Summit
Computer History Museum, Mountain View, California
April 10, 2014
Who: Javier DeLaCruz, senior director of engineering, eSilicon Corporation
- Calvin Cheung, VP of engineering, ASE U.S.
- Bob Patti, CTO & VP of design engineering, Tezzaron
- Dr. Riko Radojcic, director, advanced technology engineering, Qualcomm Incorporated
- Dr. Arif Rahman, program director & architect, Altera Corporation
- Brandon Wang, director, 3D-IC solutions, Silicon Realization Group, Cadence Design Systems, Inc.
Abstract: 2.5 & 3D package technology holds great promise for enabling heterogeneous integration and reducing design complexity. The keynote address will provide an overview on where the industry stands in terms of developing and commercializing 2.5D/3D semiconductor technology and what remains to be done. A panel discussion will follow and address the use case for 2.5D/3D package technology, as well as the business needs within the supply chain in order to ignite 2.5D/3D package technology adoption and market growth, changing it, if possible, from a nascent alternative to a mature option.
About Javier DeLaCruz
Javier DeLaCruz is the senior director of engineering at eSilicon Corporation. He is responsible for foundry, packaging, signal integrity, product and test engineering. He has also led eSilicon's 2.5D and 3D MoZAIC package system initiatives. DeLaCruz has over 17 years of experience in semiconductor packaging and is a senior member of IEEE. He has extensive knowledge in analog design, high-speed digital design, thermal and electrical simulation, and package assembly.
eSilicon, the largest independent semiconductor design and manufacturing services provider, delivers custom ICs and custom IP to OEMs, independent device manufacturers (IDMs), fabless semiconductor companies (FSCs) and wafer foundries through a fast, flexible, lower-risk path to volume production. eSilicon serves a wide variety of markets including communications, computer, consumer, industrial and medical. http://www.esilicon.com
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For more information, please contact: Sally Slemons eSilicon Corporation 408.635.6409 Email Contact Susan Cain Cain Communications 408.393.4794 Email Contact